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• 4.6A, 200V• rDS(ON) = 0.800• Single Pulse Avalanche Energy Rated• SOA is Power Dissipation Limited• Nanosecond Switching Speeds• Linear Transfer Characteristics• High Input Impedance• Related Literature - TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
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Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . VDS 200V
Drain to Gate Voltage (RGS = 20k) (Note 1) . . . . . . . . . . . .. . . . . . . . . VDGR 200V
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . .. . . . . ID 4.6A
TC = 100. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . .. . . . . . . . . ID 2.9 A
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . ... . . . . . . . . . . . . . . . .. IDM 18 A
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS ±20 V
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD 50 W
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.4 W/
Single Pulse Avalanche Energy Rating (Note 4) . . . . . . ......... . . . . . . . . . . EAS 85 mJ
Operating and Storage Temperature . . . . . . . . . . . . . . . . .... . .TJ, TSTG -55 to 150
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . .TL 300
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . ... . . . . . . . . .Tpkg 260
Post a Buying Lead
Required Field 
